“Boundless Intelligent Inspection, Precision Testing for the Future” East China Seminar

The “Boundless Intelligent Inspection, Precision Testing for the Future” East China Seminar brought together senior executives, technical experts, and partners from leading enterprises across the industry. Centered on three core pieces of equipment—rotary CCD four-wire testers, continuous blind-hole inspection machines, and high-resolution color circuit inspection systems—the event offered an in-depth exploration of cutting-edge technologies and real-world applications in industrial precision inspection. Participants engaged in meaningful discussions on industry pain points and innovation directions, aiming to build an open exchange platform and collaborate with partners across the value chain to explore new pathways for intelligent manufacturing inspection and unlock high-quality development opportunities.
The seminar was structured around “technical sharing + live demonstrations + in-depth discussions,” focusing on the technical breakdown and application scenarios of the three core inspection systems. The rotary CCD four-wire tester strengthens the defense line for circuit performance; the continuous blind-hole inspection machine addresses the challenges of detecting microscopic defects; and the high-resolution color circuit inspection system enables micron-level defect identification. From iterative technological advancements to application-focused analysis, the event directly tackled industry challenges, built an efficient communication bridge for industry partners, and contributed to the innovation of precision inspection technologies and the high-quality development of intelligent manufacturing.
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Chairman Wang Guang-Shiah stated at the seminar that the event was centered on “technical sharing + live demonstrations + in-depth discussions,” focusing on Machvision’s three core inspection systems. It directly addressed industry pain points, built an efficient communication bridge for partners across the value chain, and promoted innovation in precision inspection technologies as well as the high-quality development of intelligent manufacturing.
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CEO Chen Fu-Sheng stated that the three core systems introduced at this event will create a high-precision, closed-loop inspection solution covering the entire PCB manufacturing process. These systems are designed to address bottlenecks in missed detections and false judgments, improving efficiency while providing customers with stable and reliable process quality assurance.
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KK Xia, General Manager of the PCB Business Group, stated that the company will integrate real-world production scenarios and address inspection requirements at different stages of the manufacturing process, providing customers with customized equipment application solutions to help improve yield rates and optimize costs.
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Ding Yong-Zhen, General Manager of the Technology Center, stated that the company will focus on full lifecycle technical support, providing services such as equipment commissioning, maintenance, and optimization. This ensures stable operation of the equipment and safeguards customers’ quality control.
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Advanced Four-Wire Electrical Tester: Strengthening the Defense Line for Circuit Performance: Designed to address the challenges of testing high-density circuits and micro blind holes, it enables full contact inspection and resolves common issues of missed detection and false judgments found in traditional equipment.
Safeguarding Product Yield: By identifying potential circuit performance risks in advance, it establishes a reliable first line of defense in PCB production, preventing large-scale quality issues.
Efficient and Stable Automation: Reduces manual intervention and standardizes the testing process, ensuring consistent inspection results and improved production efficiency.
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Future Outlook: Building on technology and driven by innovation. SISSCA will take this seminar as a new starting point to further deepen its presence in the field of industrial precision inspection, continuously refining more efficient and intelligent inspection equipment. Together with industry partners, it will explore new possibilities in intelligent manufacturing inspection and inject sustained momentum into the high-quality development of the industry.

